Join Our 1-Day Training Workshop on Advanced Electronic Packaging!
Dive into the specialized chapters of advanced electronic packaging with our comprehensive workshop.
Register now - it's free of charge!
Our topics
- 3D/2.5D System Integration
- Design Methods for 3D Systems
- Selected Technologies for 3D/2.5D Integration
- 3D Lithography and Printing
- 3D MEMS Packaging Technologies
Who Should Attend
This workshop is designed for professionals in electrical engineering looking to broaden their horizons in microelectronic system concepts and their technological realization. A minimum of a Bachelor’s degree is required.
Why You Profit from Attending
- Gain insights into microelectronic system advances and miniaturization options to enhance your designs.
- Learn from scientific experts at leading Fraunhofer institutes.
- Receive a compact but comprehensive overview of structured knowledge in just one day.
