1-Day Training Workshop on Advanced Electronic Packaging
Take advantage of this unique opportunity to deepen your knowledge in advanced electronic packaging. This 1-day training workshop is crafted for professionals who are eager to master the latest concepts and techniques in this fast-evolving field.
Why Attend?
- Get insights into emerging trends in microelectronic systems and discover innovative miniaturization techniques to optimize your designs.
- Learn directly from experienced scientific experts from leading Fraunhofer institutes, renowned for cutting-edge research.
- Experience a thorough yet concise overview of structured knowledge, packed into a single day.
Agenda Highlights
- 3D/2.5D System Integration: Explore new ways to leverage 3D and 2.5D technologies for efficient system integration.
- Design Methods for 3D Systems: Learn effective design methodologies for creating robust and scalable 3D systems.
- Selected Technologies for 3D/2.5D Integration: Familiarize yourself with critical technologies enabling advanced integration.
- 3D Lithography and Printing: Discover the latest developments in 3D lithography and its applications in electronic packaging.
- 3D MEMS Packaging Technologies: Delve into packaging technologies for MEMS, key to advancing functionality and performance in microelectronics.
Who Should Attend?
This workshop is tailored for professionals in electrical engineering and related fields, aiming to enhance their expertise in microelectronic systems and their practical implementation. A minimum of a Bachelor’s degree in engineering or a related discipline is required.
When and Where?
- November 26, 2024 (9:00 am - 5:00 pm)
- Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS (Münchner Straße 16, 01187 Dresden, Germany)
Free registration below!
