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Modular Integration of thin Heterogeneous Sensor Systems
Platform for Micromechanical Ultrasonic Transducers
Structure-Integrated Wireless Sensors for Machine Tools
Research Project »Test Wafer Hub«
300 mm Wafer Service
Universal Sensor Platform
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3 D / 2.5 D System Integration Workshop
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Research Project
»Structure-Integrated Wireless Sensors for Machine Tools«
more info
Research Project
»Platform for Micromechanical Ultrasonic Transducers«
More Info
Research Project
»Modulare Integration für dünne, heterogene Sensorsysteme«
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Research Project
»Test Wafer Hub«
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Research Project
»Universal Sensor Platform« (USeP)
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Platform
»300 mm Wafer Services«
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